Hangzhou Freqcontrol Electronic Technology Ltd.
Splitting up from former China National Scientific instrument and materials company in 1999, Hangzhou Freqcontrol Electronic Technology Ltd. is a leading Chinese manufacturer who involves in piezoelectric crystals and surface acoustic wave products as well as the relative single crystal growth and substrates for use in the telecommunications and general time and frequency industries.
Optical Grade Quartz Wafers
Fe doped LT Wafers
Series Glass & Fused Silica Wafers
Finished Crystal
SAW Grade Lithium Tantalate Wafers
Optical Grade Lithium Tantalate Wafers
SAW Grade Lithium Niobate Wafers
Optical Grade Lithium Niobate Wafers
CQT's primary goal is "To be a reliable primary microelectronics substrates supplier in today's World”. The entire organization...
Since 1999 we have been custom fabricating a wide variety of piezo-electricity materials and products for industry and individuals world-wide.
CQT is committed to conducting its all operations in a socially responsible, ethical, and sustainable manner...
Apr. 2024
Sep. 2023
the relationship of SAW substrates between orientation and flat
Jul. 2023
Lithium Niobate Thin Films on Insulator is kind of POI (Piezoelectric on Insulator) wafer. It's stacked sequence structure is made of support substrates that can be silicon, quartz, fused silica, sapphire or LN wafer, the interlayer is thermal oxide SiO2 that works as insulator and lithium niobate film is the functional layer above the insulation
Dec. 2022
CQT production line Measurement and inspection methods
Jun. 2023
Here is Quartz Materials China Manufacturer talking about What Is The Polishing Technique Of Quartz Glass Lenses. After the quartz glass lens is finely ground by the grinding liquid, it has a crack layer of about 2–3 m thick on the outside, and the method of eliminating the crack layer is polishing.
Nov. 2022
Here is High Quality Quartz Materials China Factory talking about Production Process Of Quartz Rods. 1. A damaged layer on the surface of the Fused Silica Wafers due to processing stress after work.2. Use the sandblasting method to feel the lower half of the defects and defects on the wafer.
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